Direct Appliance of Modesto

888-238-3000

Marantz® Reference Series Integrated Amplifier

$4,999.00

At a Glance

Marantz® Reference Series Integrated Amplifier with LCD display and headphone jack

Proposition 65 Warning for California Residents

Exclusive HDAM Technology Delivers Exceptional Dynamic Range

The PM-11S3 incorporates no less than 40 HDAM SA3 latest generation modules, which feature ultra fast slew rate for true wideband response and maximum dynamic range, including multiple HDAM SA3 modules in the phono stage

Phono Input For Connections To Vinyl Record Players

The MM/MC phono section incorporates our latest Constant Current Feedback gain stage which features DC Servo equalization that eliminates the discontinuities in tonal balance caused by conventional RIAA equalization using ordinary dual band negative feedback topology, for the purest reproduction of your favorite vinyl recordings.

Robust Power Supply Supports Multiple Loudspeakers

The power supply features a massive 950 VA toroidal transformer wound with OFC (Oxygen Free Copper) for maximum headroom and operational stability, securely anchored to the chassis via its own solid metal sub-mounting plate which eliminates the possibility of transformer-induced vibrations. Instead of a conventional bridge rectifier, the PM-11S3 incorporates fast response, high current Shottky barrier diodes, which provide faster switching and lower voltage drop for a more pure DC output

Versatile Connectivity

The front end of the PM-11S3 provides maximum control and configuration flexibility, as it can be configured as a conventional stereo integrated amplifier, or set up with another PM-11S3 as a dual component four channel configuration for bi-amp operation, and it can also be paired with an A/V surround processor/pre-amp and used as a stereo power amplifier for the main left and right speakers in a home theater system via the Power Amp Direct inputs.

Rugged, Durable Construction

PM-11S3 features a new chassis design with beautiful casework that includes a new 5mm thick solid aluminum top panel for maximum chassis rigidity that allows additional components to be stacked on top. The chassis also features a dual layer bottom panel for additional strengthening, and all internal chassis surfaces are copper plated for maximum resistance to RF and electrically induced interference.